Uf300 Prober Manual

Accretech Tsk Uf200 Uf200sa Uf3000, Find Complete Details about Accretech Tsk Uf200 Uf200sa Uf3000,Wafer Prober from Other Test Instruments Supplier or Manufacturer-csiequipmentsales.com. International B2B marketplace for surplus and used assets.

Select information on Xandex inking products by choosing an inking application tab. If you do not see your equipment or application listed, please contact Xandex Customer Service.

Xandex offers three inker types for high speed inking applications. Series 600 inkers incorporate a high-speed solenoid for use with DM-1 cartridges. The pneumatic Series X1000 & X4000 use DM-2 cartridges to afford a wide range of dot sizes at any speed. The Motorized-Z inker enables motorized z height adjustment and incorporates small dot and large dot modes, which allow dot sizes from 6-50 mil. All inkers feature flip up manipulators and an X,Y adjustment joystick. The low profile X5100 installs in the optical bridge on the listed EG probers. Off-Line inkers are also suitable for Post-Probe inking.

UF300-3, UF450-3, UF600-3, UF750-3, UF900-3 UF1050-3 NATURAL GAS I2H LPG Propane I3P IMPORTANT NOTE. Figure 8.5.1 Combustion analyser probe setting. Uf300 Prober Manual pdfsdocuments2 com. Tsk Prober Manual luftop de. FemtoTek Inc Wafer prober drivers. Uf200 Prober Manual Stephen McDermott. Tsk Uf3000 Prober.

The inverted Series 200 mounts underneath the probe ring. Post-Probe inkers also provide sufficient clearance for most Overhead Testing applications.

Xandex offers four inkers for post probe inking. All inkers are also suitable for some Overhead Testing & high-speed Off-Line Inking. Inker Model X1412 designed for the TSK APM 90 or UF200 series probers fits on the existing inker mount. Inker X5100 designed for the EG 40X0 series probers fits in the Optical Bridge. X5200 Series designed for the TEL P8 probers mounts on the Optical Bridge, or on the SACC Arm. All inkers allow dot range of 15-50 mil and utilize DM-2.3 cartridges.

Xandex offers electric and pneumatic inkers for cabled probing. Series 100 provides vertical positioning via slide bracket and adjustment knob. Coarse X, Y adjustment and quick inker removal is accomplished by loosening one knob that holds the inker to its mounting plate. The joystick in Series 300 provides fine X, Y adjustment. Series 600 is the only high speed electric inker. Use DM-1, or DM-1.25 cartridges. For 5 mil applications, use an H2 model holder (with plunger adjustment) instead of an H1. Series X1000 are pneumatic inkers, suitable for high-speed application and utilize DM-2 cartridges.

Many optical inspection applications require retrofit of an existing manipulator and do not use a complete Xandex assembly. DieMarker™ is a hand-held pneumatic inker, which may also be used for any application requiring manual inking (i.e. edge die, packaged devices). Use DM-2 cartridges for DieMarker™ and DM-1, DM-1.25, or DM-S for all other models.

Analytical probers have limited inker clearance due to high-powered microscope objectives and multiple probers. Most analytical probers require retrofit of an existing micromanipulator, and do not use a complete Xandex assembly (see also Retrofits). Use DM-1 or DM-1.25 cartridges.

Uf300 Prober Manual Pdf

Laser trimming applications require the inker to rest at a very shallow angle under the microscope lens and the lasers. For sufficient clearance, inkers may have a 'side arm' style holder mounting rather than the typical slide bracket. Use DM-1, DM-1.25, or DM-S cartridges.

Cartridge holders are available to retrofit most other manufacturers’ inkers. To order, specify body style, coil voltage, connector type, and plunger size. Use DM-1 or DM-1.25 cartridges. Retrofit all H-style holders with a Plunger Stop Assembly for 5 mil dot applications.

* requires special DM-0.6 cartridge
** complete inker kit is also available. see post-probe inking.
*** retrofit includes pneumatic controller.

TSK UF3000 was developed to be the de facto standard model for the semiconductor testing process that accurately meets these needs. It is a fully automatic, ultra-high function probing machine that meets the total range of customer requirements including high-mix low-volume production for System LSI etc. or mass production for memories etc.

In addition to the high-rigidity of the machine, the probe mark inspection (PMI) features an automated adjustment sequence to guarantee 100% probe to pad contact.

Uf300 Prober Manual 2016

The UF3000 increases through-put with ease of probe card conversion, quick set-up and improved processing capability. This enables rapid integration into 300mm wafer mass production lines.
The machine received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency), and we have already received 60 orders. The company will use its established advantage as the No.1 supplier in this field to promote the adoption of UF3000 in 300mm wafer mass production plants.

High-spec wafer probing machine UF3000

Features
1.High through-put
The new high performance CPU helps to decrease set up time.
Multiple CPUs allow for parallel processing to decrease overall lot process time.
2.Easy Operation
Easy conversion of probe cards
Easy set up of parameters through new Touch To Go (TTG) function. Also supports multiple languages. Selecting a new language can be done without reboot.
New image processing system enables probe to pad alignment, probe mark inspection and self-diagnostic functions.
Compliant with 200 mm and 300 mm wafers on one load-port.
3.Ultra precision
Probe alignment is conducted at same height as actual probing, thereby minimizing any Z – axis error.
For ultra high rigidity, UF3000 uses a 4 axes driving mechanism (QPU: Quad Pot Unit) for Z – axis.
OTS (Optical Target Scope) enables measurement of the relative position of the cameras with absolute accuracy.
Total Accuracy
within ±2µm